This Sputtering Targets and Evaporation Materials market report has been prepared by considering several fragments of the present and upcoming market scenario. The market insights gained through this market research analysis report facilitates more clear understanding of the market landscape, issues that may interrupt in the future, and ways to position definite brand excellently. It consists of most-detailed market segmentation, thorough analysis of major market players, trends in consumer and supply chain dynamics, and insights about new geographical markets. The market insights covered in Sputtering Targets and Evaporation Materials report simplifies managing marketing of goods and services effectively.

Global Sputtering Targets and Evaporation Materials Market was valued at USD 2.88 billion in 2021 and is expected to reach USD 4.17 billion by 2029, registering a CAGR of 5.5% during the forecast period of 2022-2029.

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Market Overview:

The Sputtering targets and evaporation materials market is witnessing an increase in demand due to the rise in electronics industries and growing production of electronic products such as semiconductors and computer chips to create hard-edged thin coatings for a variety of tools using alloys and ceramic targets.

Some of the major players operating in the Sputtering Targets and Evaporation Materials market are Materion Corporation (U.S.), SCI Engineered Materials (U.S.), Hitachi Metals Ltd (Japan), Ulvac, (Japan), Treibachner industrie AG (Austria), mds.umicore (Germany), Kurt J. Lesker Company (U.S.), PLANSEE SE (Austria), Furuya Metal Co., Ltd. (Japan), ABLE TARGET LIMITED (China), Sino Santech Materials Technology Co. Ltd (China), Materion Corporation (U.S.), Nichia Corporation (Japan), Grinm Advanced Materials Co., Ltd.(Japan), Soleras (Belgium) and SCI Engineered Materials (U.S.) among others.

Global Sputtering Targets and Evaporation Materials Market Scope

The sputtering targets and evaporation materials market is segmented on the basis of type, sputtering method, components, evaporation method, material type, sputtering targets and application. The growth amongst these segments will help you analyze meagre growth segments in the industries and provide the users with a valuable market overview and market insights to help them make strategic decisions for identifying core market applications.

Type

  • Sputtering Targets

  • Evaporation Materials

On the basis of type, the sputtering targets and evaporation materials market has been segmented into sputtering targets and evaporation materials.

Sputtering Method

  • DC Sputtering

  • Reactive Sputtering

  • RF Sputtering

  • Ion Assisted Sputtering

  • Magnetron Sputtering

  • Gas Flow Sputtering

  • Others

The sputtering targets and evaporation materials market has also been segmented on the basis of sputtering method into dc sputtering, reactive sputtering, RF sputtering, ion assisted sputtering, magnetron sputtering, gas flow sputtering and others.

Components

  • Vacuum Pump Vacuum Gauge

  • Process Gas Monitor

  • Leak Detector

  • Thin Film Measurement/Deposition Controller

  • Optical Process Monitor

  • Vacuum Valve

  • Parts of Ultra-High-Vacuum

  • Transfer Robot, Others

On the basis of components, the sputtering targets and evaporation materials market is segmented into vacuum pump vacuum gauge, process gas monitor, leak detector, thin film measurement/deposition controller, optical process monitor, vacuum valve, parts of ultra-high-vacuum, transfer robot and others.

Evaporation Method

  • Thermal Evaporation

  • Electron-beam Evaporation

  • Vacuum Evaporation

  • Reactive Evaporation

  • Others

On the basis of evaporation method, the sputtering targets and evaporation materials market is segmented into thermal evaporation, electron-beam evaporation, vacuum evaporation, reactive evaporation and others.

Material Type

  • Pure Metals

  • Isotope

  • Alloys

  • Compounds

  • Others

On the basis of material type, the sputtering targets and evaporation materials market is segmented into pure metals, isotope, alloys, compounds and others.

Sputtering Targets

  • Metallic and Elemental Sputtering Targets

  • Oxide Sputtering Targets

  • Alloy Sputtering Targets

  • Compound Sputtering Targets

  • Others

On the basis of sputtering targets, the sputtering targets and evaporation materials market is segmented into metallic and elemental sputtering targets, oxide sputtering targets, alloy sputtering targets, compound sputtering targets and others.

Application

  • Aerospace and Defense

  • Dentistry

  • Fine Art Materials

  • Agriculture

  • Electronics

  • Industrial

  • Energy

  • Optics

  • Others

On the basis of application, the sputtering targets and evaporation materials market is segmented into aerospace and defense, dentistry, fine art materials, agriculture, electronics, industrial, energy, optics and others.

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Table of Content:

Part 01: Executive Summary

Part 02: Scope of the Report

Part 03: Global Sputtering Targets and Evaporation Materials Market Landscape

Part 04: Global Sputtering Targets and Evaporation Materials Market Sizing

Part 05: Global Sputtering Targets and Evaporation Materials Market Segmentation By Product

Part 06: Five Forces Analysis

Part 07: Customer Landscape

Part 08: Geographic Landscape

Part 09: Decision Framework

Part 10: Drivers and Challenges

Part 11: Market Trends

Part 12: Vendor Landscape

Part 13: Vendor Analysis

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